Thermal Packaging Laboratory

The Thermal Packaging Laboratory in Fitzpatrick Hall is designed to carry out basic and applied research in the broad area of electronic cooling with funding from both industrial companies and government agencies. The laboratory occupies approximately a space of 2000 square feet, and houses an infrared image system, data acquisition system, video and high-speed cameras, and a number of PC cabinets. In addition, a variable cross-section forced-convection heat sink test facility for both external and internal flows with full instrumentation capabilities and speed range of 2-30 m/s has been fabricated.

Direct comments, questions, and corrections to amedept@nd.edu