Engineered Nanostructured Materials for Advanced Thermal Management, Rectification, and Encryption

Apr
4

Engineered Nanostructured Materials for Advanced Thermal Management, Rectification, and Encryption

Sheng Shen, Carnegie Mellon University

3:30 p.m., April 4, 2023   |   B001 Geddes Hall

In this talk, I will give three examples about utilizing specially engineered nanostructured materials to develop advanced thermal components. First, I will demonstrate a super-solder consisting of a heterogeneous copper-tin nanowire array that has polymer-like compliance with a shear modulus 2-3 orders of magnitude lower than traditional solders and can reduce thermal resistance by two times as compared with the state-of-the-art thermal interface materials. The super-solder also exhibits exceptional long-term reliability with 1,000 thermal cycles over a wide temperature range.

Sheng Shen
Sheng Shen

Second, I will report an ultra-high-contrast and reversible nanoscale thermal switch based on the structural phase transition in crystalline polyethylene nanofibers, which enables a ~ 10X thermal switching ratio between the on-state (high) and the off-state (low) thermal conductance values. To the best of our knowledge, the observed high switching ratio exceeds by far any reported experimental values for solid-solid phase transition, solid-liquid phase transition and desiccation-hydration of materials. By fabricating a heterogeneous “irradiated-crystalline nanofiber junction” using an electron beam, we also demonstrated a high- performance solid-state nanoscale thermal diode with a rectification factor as high as ~ 54 %, which exceeds any existing solid-state nanoscale thermal diodes.

Finally, I will present the design and fabrication of bio-inspired brochosome structures with and without through-holes, which appear visually similar under visible light but have their emissivity profiles significantly distinct from each other. Such a property allows us to encode physical information with brochosome arrays that can only be decoded under infrared signals, which is potentially useful in the areas of thermal encryption, infrared holograph, and data storage.

Sheng Shen is a Professor at the Mechanical Engineering Department of Carnegie Mellon University (CMU). He also holds courtesy appointments in both the Electrical and Computer Engineering and the Materials Science and Engineering Departments at CMU. He received his Ph.D. degree from the Mechanical Engineering Department, MIT, in 2010. Prior to joining CMU in 2011, he conducted his postdoctoral research at UC-Berkeley. His research interests include nanoscale heat transfer and energy conversion, nanophotonics, and their applications in energy conversion, thermal management, sensing, and multifunctional materials.

Professor Shen is a recipient of NSF CAREER Award, DARPA Directors Fellowship, DARPA Young Faculty Award, and Elsevier/JQSRT Raymond Viskanta Award for Spectroscopy and Radiative Transfer. He also received the CMU Deans Early Career Fellowship, the Philomathia Foundation Research Fellowship in Alternative Energy Research from UC-Berkeley, a Hewlett-Packard Best Paper Award from ASME Heat Transfer Division, and a Best Paper Award in Julius Springer Forum on Applied Physics.